电子研发工程师英文简历表格

[英文专业大学生职业规划]第一章：自我认知自我认知是对自己进行全方位，多角度的分析 1.个人基本情况我是一个别开朗又不内向的人，与人交往融洽，细心有条理。不喜欢竞争和冒险，喜欢自由自在的生活，喜欢按自...+阅读

一份好的简历不仅有主题突出的经历，而且有特点的包装和格式是吸引注用人单位人事经理的主要方面之一。如果使用各种字体格式，如斜体、大写、下划线、首字突出、首行缩进或尖头等等方式，有重点有节奏地表达思想。有些求职者以为另类的简历会让人耳目一新，所以往往追求新、奇的特色。除非是你寻求的职位有些别样，最好是在简洁、醒目上下功夫，不要过于花哨，否则适得其反。

下面是范文大全小编和大家分享的电子研发工程师英文简历表格，更多内容请关注(.fwdq.)。Name：fwdqHukou：ShanghaiResidency：ShanghaiWork Experience：Current Salary：Tel：E-mail：.fwdq.Career ObjectiveDesired Industry：Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, CertificationDesired Position：Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist StaffDesired address：Shanghai ,Hongkong ,Beijing ,Taiwan ,MacaoDesired Salary：NegotiableWork Experience20xx/06Present***panyIndustry: Electronics/Semiconductor/IC

Intel Flash Engineering Department Individual Contributor

Responsibilities：

I he been working in Intel Flash Assembly Test Engineering

Department as an Individual Contributor since June of 20xx.

Being Leader of ATE Yield team, I he been working with the team members to improve the products yield. Our efforts are paid off:

The yield of year 20xxhas been dramatically increased than that of year 20xx.The yield of all products, consecutively meets the goal.The total amount of cost sing due to yield improvement is more than $1 million pared with year 20xx. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles responsibilities among team members, follow up the progress. Finally, the team has made a great cost sing of $2.5M in 20xx.Report Directly to: Department ManagerNumber of Subordinate: 14

Reference: Bao Powel

Achievements: Being Leader of ATE Yield team, I he been working with the team members to improve the products yield.

Our efforts are paid off:

The yield of year 20xxhas been dramatically increased than that of year 20xx.The yield of all products, consecutively meets the goal.The total amount of cost sing due to yield improvement is more than $1 million pared with year 20xx. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles responsibilities among team members, follow up the progress. Finally, the team has made a great cost sing of $2.5M in 20xx.20xx/0120xx/05Intel(Shanghai) Technology Development Ltd. panyIndustry: Electronics/Semiconductor/IC

Intel STTD-China Department Electronics Development Engineer

Responsibilities：

I had been working in STTD-China since Jan 20xxto May 20xxas a senior module engineer.At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.Report Directly to: Hopman MarkNumber of Subordinate: 14

Reference: Bao Powel

Reason for Leing: I was transferred to Intel（Shanghai）Products Ltd. pany due to the internal re-anization in June of 20xx.

Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.20xx/0520xx/01Nanyang University of Science TechnologyIndustry: Electronics/Semiconductor/IC

Electronics Electrical Engineering Department Research Fellow

Responsibilities：

I work in Electronics Electrical Engineering Department of Nanyang University of Science Technology as a Research Fellow.I majored at Gate Oxide Reliability Research in the duration.Report Directly to: Professor Pey Kin Leoh

Subordinate: 3

Reference: Patrick Low

Reason for Leing: I pleted the project which I undertook by myself, and want to do more challenging job.

Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.Project Experience20xx/01PresentAssembly NPI (New Product Introduction)Project Deion: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.

Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.20xx/0120xx/12Marginal Electrical Boards RescueProject Deion: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around 2.5 million dollars was sed finally.

Responsibility: Being the team leader, I took the job of data analysis, define each members role, make program plan, coordinate each team member and follow up the progress.20xx/1020xx/05Optimization the current Test Process Order for Flash MemoryProject Deion: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.

Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, anize and implement.20xx/0520xx/12Test Yield of Flash memory ImprovementProject Deion: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to oided unexpected things happen.

Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.Education and Training 20xx/0520xx/01Nanyang University of Science Technology Microelectronics DoctorateI worked in Nan yang University of Science Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration.20xx/0320xx/03Seoul National University of Korea Microelectronics OthersI had been working in National Physical Lab of Seoul National University in Korea since March of 20xxto March of 20xxas a Post-doctor. Where I unhook the project of research development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology.20xx/0320xx/03Shanghai Institute of Microsystemsand Information Technology，Chinese Academy of Sciences InformationTechnology Doctorate20xx/0920xx/03Nanjing University of Science Technology Material Science and Engineering MasterBeing a master student of this period, I he published one EI paper about Super-fine metal powers electrical characteristics.20xx/0920xx/07Nanjing University of Science Technology Material Science and Engineering Bachelor20xx/0720xx/07Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification DepartmentProfessional SkillsLanguage Skills：English: EXCELLENT

Korean:AVERAGEputer Skills：Technology skilled 96Month

SAPunderstanding 8MonthCertificate：20xx/11MCSE

20xx/06CET6Self-appraisal7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.